Besi Switzerland AG provides sales, service and support for Besi’s semiconductor assembly and packaging equipment and serves customers in the semiconductor and electronics industries.
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Industry:Mechanical Engineering Industry
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Single chip, multi chip, multi module, flip chip, thermal compression bonding, fan-out wafer level packaging, hybrid und embedded bridge die bonding systems und die sorting systems.
Packaging Equipment
Molding-, Trim-&-Form- and Singulation systems for conventional, ultrathin and wafer-level packaging applications under the Fico brand.
Plating Equipment
Tin-, copper-, precious-metal and solar-plating systems as well as associated process chemicals for the electronics industry.
After Sales Support
Spare parts, tooling, conversion kits and other services for installed base customers, with global customer service and quick response time.